Materials for Information Technology: Devices, Interconnects and Packaging

Materials for Information Technology: Devices, Interconnects and Packaging (Engineering Materials and Processes)

Publisher:Springer | ISBN: 1852339411 | edition 2005 | PDF | 527 pages | 11,2 mb

The fast-developing information technology industry is driving a need for new materials in order to facilitate the development of more reliable microelectronic products.

Materials for Information Technology is an up-to-date overview of current developments and R&D activities in the field of materials used for information technology with a focus on future applications. Included are:

* materials for silicon-based semiconductor devices (including high-k gate dielectric materials);

* materials for nonvolatile memories;

* materials for on-chip interconnects and interlayer dielectrics (including silicides, barrier materials, low-k and ultra low-k dielectric materials); and

* materials for assembly and packaging

The latest results in materials science and engineering as well as applications in the semiconductor industry are covered including the synthesis of blanket and patterned thin film materials, their properties, constitution, structure and microstructure. Computer modelling and analytical techniques to characterise thin film structures are also included to give a comprehensive survey of materials for the IT industry.

My Links

To thank me use my links, please!